ESD Semiconductor wafer tape UV dicing Tape/film No residue after removal Low adhesion release and UV release

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  • 100 - 199 Bags
    $2.00
  • >=200 Bags
    $1.96
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Overview
Quick Details
Place of Origin:
Guangdong, China
Brand Name:
ys
Model Number:
P1505
Adhesive:
Acrylic, Acrylic UV-off Adhsive
Adhesive Side:
Single Sided
Adhesive Type:
Pressure Sensitive
Design Printing:
No printing
Material:
Polyolefin film
Feature:
Heat-Resistant
Use:
MASKING
Backing:
Polyolefin film
Liner:
PET Release liner
Width:
1080/1200mm
Length:
100M
Backing Thickness:
0.15±0.005mm
Adhesive Thickness:
0.02±0.002mm
Liner thickness:
0.050±0.005mm
Supply Ability
Supply Ability:
10000 Roll/Rolls per Week
Packaging & Delivery
Packaging Details
As customer requirment
Port
shenzhen
Lead Time :
8-12days
Product Description

 

ESD Semiconductor wafer tape UV dicing Tape/film No residue after removal Low adhesion release and UV release

The UV tape of the backgrinding wafer tape line features high adhesive strength, no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.

             

 

ESD Semiconductor wafer tape UV dicing Tape/film No residue after removal Low adhesion release and UV release

Feature :

 

Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Superior TTV ;Soft & Hard type
Multiple thickness types ;No residue after removal
Low ionic impurities; Easy detaping
Many adhesive types and strengths

 

Excepet UV Dicing Tape ,We also can provide Heat Resistant Tape for Dicing :

 

 

Contact us

Lulu Liu/sales manager

Phone:  0086-139 2657 5287     

             0086-0755-29091712

Facebook :https://www.facebook.com/lulu.liu.334

Linkedin :https://cn.linkedin.com/in/kaptontape

Wechat:lulu666lucky

Skype : lulusales4@outlook.com

Whats app :0086 13691873475